Inventor · name-matched record
LIN PO-YAO
11 granted patents·6 pending applications·1 citations·filing 2021–2025
80Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
17 records- 0195US2026076184A1Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0294US2026011622A1High efficiency heat dissipation using discrete thermal interface material filmsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0393US12550757B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·1 cites·20 claims
- 0491US2026090423A1Semiconductor Package and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0586US12568824B2Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 3, 2026·0 cites·20 claims
- 0684US12550770B2Embedded stress absorber in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0784US12550792B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0884US2026076206A1Package structure with a plurality of corner openings comprising different shapesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0981US12557656B2Stacking via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 1078US12538852B2Package structure containing chip structure with inclined sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 1177US12568820B2Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·20 claims
- 1272US12557645B2Semiconductor packages with thermal lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 17, 2026·0 cites·20 claims
- 1365US2026082999A1Semiconductor device and method for manufacturing the sameINTEL CORP·Filed 2024·Application pending·0 cites
- 1464US12519066B2Package structure with a plurality of corner openings comprising different shapes and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 6, 2026·0 cites·20 claims
- 1562US2026082998A1Semiconductor device and method for manufacturing the sameINTEL CORP·Filed 2024·Application pending·0 cites
- 1659US12593693B2Package lid with a vapor chamber base having an angled portion and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·20 claims
- 1747US12588505B2Thermal and mechanical enhanced thermal module structure on heterogeneous packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →