Inventor · name-matched record
LIN SUNG-KUN
3 granted patents·2 pending applications·0 citations·filing 2023–2025
38Inventor score
Technology areasH10W
Files withAALTOSEMI INC5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0157US12550796B2Electronic package and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 10, 2026·0 cites·10 claims
- 0256US12599003B2Manufacturing method of package substrateAALTOSEMI INC·Filed 2023·Granted Apr 7, 2026·0 cites·6 claims
- 0355US12557664B2Electronic package and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 17, 2026·0 cites·2 claims
- 0454US2026026362A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0553US2026053033A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →