Inventor · name-matched record
LIN WEI HUNG
4 granted patents·1 pending application·0 citations·filing 2022–2025
56Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0184US2026060114A1Semiconductor package including a surface with a plurality of roughness values and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0283US12543552B2Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
- 0377US12550769B2Method for forming a package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0469US12519080B2Systems for fluxless bonding using an atmospheric pressure plasma and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 0540USD1109263SBaseball training ballBLACKSTAR CORP·Filed 2024·Granted Jan 13, 2026·0 cites·1 claims
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Identity basis: exact name match across USPTO filings. How scoring works →