Inventor · name-matched record
LIN WEN-YI
1 granted patent·3 pending applications·0 citations·filing 2022–2025
13Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0183US2026090399A1Dummy through vias for integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0270US12557646B2Multi-die package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 17, 2026·0 cites·20 claims
- 0370US2026096385A1Adhesive tape application system to modify the adhesive strength of the adhesive tape and method of applying the adhesive tapeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0457US2026090444A1Local silicon interposer die with metallic vias, having a barrier structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →