Inventor · name-matched record
LIN YU-HUNG
4 granted patents·1 pending application·0 citations·filing 2023–2025
53Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3DONGGUAN KANGXIANG ELECTRONIC CO LTD1TAIWAN SEMICONDUCTOR MFG COMPANY LTD1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0166US12554064B2Photonic assembly for enhanced bonding yield and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0266US12543604B2Adding sealing material to wafer edge for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
- 0365US12599011B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 0462US12550417B2Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0562US2026025913A1Circuit Board Structure, Manufacturing Method Thereof and Three-dimensional Electrical Connection Structure Including the SameDONGGUAN KANGXIANG ELECTRONIC CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →