Inventor · name-matched record
LIN YUNG-CHI
1 granted patent·6 pending applications·0 citations·filing 2023–2025
14Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0184US2026060057A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0283US12550793B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0363US2026101749A1Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 0463US2026101714A1Stacking structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
- 0563US2026052961A1Method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0663US2026068738A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0761US2026047466A1Bonding apparatus and method of bonding semioconductor chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →