Inventor · name-matched record
LIU CHUNG-HSIEN
1 granted patent·1 pending application·0 citations·filing 2023–2025
10Inventor score
Files withWINBOND ELECTRONICS CORP2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0166US2026082554A1Semiconductor structures and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0262US12527037B2Semiconductor device with floating gate, and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2023·Granted Jan 13, 2026·0 cites·18 claims
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Identity basis: exact name match across USPTO filings. How scoring works →