Inventor · name-matched record
LIU CHUNG-SHI
5 granted patents·1 pending application·0 citations·filing 2022–2025
63Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0195US2026101806A1Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0286US12581977B2Bonding through multi-shot laser reflowTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 17, 2026·0 cites·20 claims
- 0385US12519024B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 6, 2026·0 cites·20 claims
- 0481US12557661B2Package structure with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0570US12588554B2Semiconductor device and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
- 0658US12593632B2Method of implanting semiconductor donor substrate and method of manufacturing semiconductor-on-insulator structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·16 claims
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Identity basis: exact name match across USPTO filings. How scoring works →