Inventor · name-matched record
LIU JEN-CHENG
6 granted patents·11 pending applications·0 citations·filing 2021–2025
65Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
17 records- 0192US2026090370A1Metal-insulator-metal device with improved performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0283US12525528B2Metal-insulator-metal device with improved performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 13, 2026·0 cites·20 claims
- 0374US12532560B2Isolation structure with multiple components to increase image sensor performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 20, 2026·0 cites·20 claims
- 0471US12557423B2Image-sensor structure and method of making thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 17, 2026·0 cites·20 claims
- 0571US12550473B2Back-trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0663US2026040702A1Single-photon avalanche diode structure and manufacturing processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0763US2026096239A1Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0863US2026090123A1Multi-die cmos image sensor integrated circuit device with reduced capacitance floating diffusion node structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0963US2026006929A1Iso image sensors and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1061US2026033029A1Surface passivation for deep trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1161US2026033324A1Enhanced capacitor for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1261US2026090121A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1360US12598985B2Semiconductor structure and forming method thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 1460US2026059885A1Image sensor device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1560US2026040711A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1659US2026006921A1Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1755US12550469B2Semiconductor device having isolation structures in pixel region and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 10, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →