Inventor · name-matched record
LIU YI-WEN
1 granted patent·2 pending applications·0 citations·filing 2024–2025
1Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0180US2026082963A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0267US2026090324A1Wafer transfer device detection system and wafer transfer deviceNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0356US12550767B2Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 10, 2026·0 cites·2 claims
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Identity basis: exact name match across USPTO filings. How scoring works →