Inventor · name-matched record
LO TING-YA
2 granted patents·4 pending applications·0 citations·filing 2021–2024
27Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0181US12564045B2Semiconductor device structure with interconnect structure having air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
- 0267US12538773B2Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 27, 2026·0 cites·20 claims
- 0363US2026068648A1Semiconductor structure having metal-organic framework material and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0463US2026060065A1Semiconductor device including interconnect structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0559US2026026338A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0657US2026096420A1Interconnect structure having metal features with different volume and materials, and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →