Inventor · name-matched record
LUAN JING-EN
2 granted patents·1 pending application·0 citations·filing 2022–2025
22Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0183US2026101804A1Low cost wafer level packages and siliconSTMICROELECTRONICS PTE LTD·Filed 2025·Application pending·0 cites
- 0258US12525564B2Integrated circuit chip package that does not utilize a leadframeST MICROELECTRONICS PTE LTD·Filed 2022·Granted Jan 13, 2026·0 cites·14 claims
- 0355US12519046B2Wafer level packaging having redistribution layer formed utilizing laser direct structuringST MICROELECTRONICS PTE LTD·Filed 2022·Granted Jan 6, 2026·0 cites·24 claims
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Identity basis: exact name match across USPTO filings. How scoring works →