Inventor · name-matched record
MALLIK DEBENDRA
6 granted patents·2 pending applications·0 citations·filing 2020–2024
63Inventor score
Files withINTEL CORP8
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0173US12575417B2Electronic package assembly with stiffenerINTEL CORP·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
- 0262US12599007B2Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate viasINTEL CORP·Filed 2021·Granted Apr 7, 2026·0 cites·16 claims
- 0361US2026090416A1Disaggregated semiconductor chip on interposer without through-substrate viasINTEL CORP·Filed 2024·Application pending·0 cites
- 0459US2026005173A1Embedded bridge with protection layer for via formation with bump pitch scalingINTEL CORP·Filed 2024·Application pending·0 cites
- 0558US12581938B2Package architecture for quasi-monolithic chip with backside powerINTEL CORP·Filed 2022·Granted Mar 17, 2026·0 cites·15 claims
- 0657US12599034B2Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposerINTEL CORP·Filed 2022·Granted Apr 7, 2026·0 cites·30 claims
- 0755US12564090B2Edge-aligned template structure for integrated packages including an integrated circuit device within an opening of the template structureINTEL CORP·Filed 2021·Granted Feb 24, 2026·0 cites·20 claims
- 0849US12517314B2High bandwidth optical interconnection architecturesINTEL CORP·Filed 2020·Granted Jan 6, 2026·0 cites·17 claims
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Identity basis: exact name match across USPTO filings. How scoring works →