Inventor · name-matched record
MARIN BRANDON C
4 granted patents·18 pending applications·0 citations·filing 2020–2024
54Inventor score
Files withINTEL CORP22
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
22 records- 0176US12573536B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2024·Granted Mar 10, 2026·0 cites·17 claims
- 0268US12555714B2Device, method, and system to provide passivation structures of a magnetic material based inductorINTEL CORP·Filed 2021·Granted Feb 17, 2026·0 cites·15 claims
- 0362US2026090435A1Selective porous glass for glass substrate singulationINTEL CORP·Filed 2024·Application pending·0 cites
- 0462US2026090410A1Embedded channels in a glass coreINTEL CORP·Filed 2024·Application pending·0 cites
- 0561US2026090431A1Glass etch protection and seware reduction by coating protectionINTEL CORP·Filed 2024·Application pending·0 cites
- 0661US2026005020A1Inorganic reconstitution carrier panelINTEL CORP·Filed 2024·Application pending·0 cites
- 0761US2026005083A1Tooling hole for hybrid panel assemblyINTEL CORP·Filed 2024·Application pending·0 cites
- 0861US2026090430A1Edge coating for glass core substrate with a frameINTEL CORP·Filed 2024·Application pending·0 cites
- 0961US2026090427A1Glass core substrate with edge biasINTEL CORP·Filed 2024·Application pending·0 cites
- 1061US2026090429A1Edge coating for glass core substrate with air pressing for profile controlINTEL CORP·Filed 2024·Application pending·0 cites
- 1161US2026090424A1Singulation incorporating an etched metal channelINTEL CORP·Filed 2024·Application pending·0 cites
- 1260US2026086114A1Socket assemblies for semiconductor devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 1360US2026076240A1Glass cores with tapered insulator edgesINTEL CORP·Filed 2024·Application pending·0 cites
- 1459US2026005163A1Glass core substrates with coupled inductor structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1559US2026082969A1Integrated circuit packages including a glass-core substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 1658US12543578B2Electronic packaging architecture with customized variable metal thickness on same buildup layerINTEL CORP·Filed 2021·Granted Feb 3, 2026·0 cites·18 claims
- 1758US2026082970A1Integrated circuit packages including a glass-core substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 1857US2026005160A1Hybrid panel with a glass substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 1957US2026001297A1Hybrid panel with a glass substrate and plated frameINTEL CORP·Filed 2024·Application pending·0 cites
- 2056US2026082965A1Microelectronic assemblies including a glass-core with post-singulation edge featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 2149US12517314B2High bandwidth optical interconnection architecturesINTEL CORP·Filed 2020·Granted Jan 6, 2026·0 cites·17 claims
- 2246US2026011704A1Micro led arrays on glass substrates for optical communicationsINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →