Inventor · name-matched record
MIRKARIMI LAURA WILLS
3 granted patents·4 pending applications·0 citations·filing 2022–2025
42Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0195US2026082960A1Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0294US2026068765A1Techniques for processing devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0394US2026060053A1Metal pads over tsvADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0472US12564106B2Techniques for joining dissimilar materials in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Feb 24, 2026·0 cites·34 claims
- 0566US12557615B2Methods for bonding semiconductor elementsADEIA SEMICONDUCTOR TECH LLC·Filed 2022·Granted Feb 17, 2026·0 cites·23 claims
- 0666US12543577B2Bonded structure with active interposerADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 3, 2026·0 cites·29 claims
- 0761US2026033312A1Structures and methods for thermal dissipation in diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →