Inventor · name-matched record
MOTOYAMA KOICHI
9 granted patents·2 pending applications·1 citations·filing 2021–2024
74Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0192US12538553B2Contact structure for power delivery on semiconductor deviceIBM·Filed 2022·Granted Jan 27, 2026·1 cites·20 claims
- 0275US12538714B2Magneto-resistive random access memory with laterally-recessed free layerIBM·Filed 2023·Granted Jan 27, 2026·0 cites·24 claims
- 0371US12588487B2Tight pitch directional selective via growthIBM·Filed 2023·Granted Mar 24, 2026·0 cites·18 claims
- 0466US12598919B2MRAM device with hammerhead profileINT BUSINESS MACHINES CORPORATION·Filed 2022·Granted Apr 7, 2026·0 cites·13 claims
- 0564US12550704B2Subtractive skip viaIBM·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0664US2026076167A1Interconnect structure for semiconductor device with airgapIBM·Filed 2024·Application pending·0 cites
- 0763US2026026331A1Low resistance via structureIBM·Filed 2024·Application pending·0 cites
- 0860US12575329B2Magneto-resistive random access memory with tapered sidewallsIBM·Filed 2022·Granted Mar 10, 2026·0 cites·20 claims
- 0960US12538785B2Fully-aligned and dielectric damage-less top via interconnect structureIBM·Filed 2021·Granted Jan 27, 2026·0 cites·18 claims
- 1058US12557555B2Magnetic tunnel junction with an etched bottom electrode having non-planar sidewallsIBM·Filed 2021·Granted Feb 17, 2026·0 cites·11 claims
- 1158US12550708B2Top via interconnect with an embedded antifuseIBM·Filed 2022·Granted Feb 10, 2026·0 cites·17 claims
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Identity basis: exact name match across USPTO filings. How scoring works →