Inventor · name-matched record
MUN KYUNG DON
1 granted patent·5 pending applications·0 citations·filing 2023–2025
8Inventor score
Files withSAMSUNG ELECTRONICS CO LTD6
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0161US12568823B2Semiconductor package structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·20 claims
- 0261US2026047489A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0361US2026090375A1Semiconductor package including heat transfer structure and dam structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0455US2026083009A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0547US2026011706A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0646US2026018500A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →