Inventor · name-matched record
MURUGAN RAJEN MANICON
2 granted patents·9 pending applications·0 citations·filing 2022–2025
22Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0182US2026082961A1Semiconductor device with multiple diesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0282US2026081353A1Electronic device with patch antenna in packing substrateTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0381US2026018542A1Method of fabricating a flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrateTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0460US12599002B2Substrate-integrated waveguideTEXAS INSTR INCORPORATED·Filed 2022·Granted Apr 7, 2026·0 cites·15 claims
- 0559US2026068677A1Electronic device with integrated sheild and heat spreaderTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0657US2026096438A1Semiconductor package with a circuit component embedded in a packaging substrateTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0754US2026068777A1Electronic device with indented die backsideTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0853US2026040960A1Delamination mitigation for an integrated circuitTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0953US2026068709A1Multi-layer electronic device packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1052US2026096453A1Substrate package having moisture dissipation channelsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1144US12519070B2System, electronic device and package with vertical to horizontal substrate integrated waveguide transition and horizontal grounded coplanar waveguide transitionTEXAS INSTRUMENTS INC·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →