Inventor · name-matched record
NAD SUDDHASATTWA
3 granted patents·5 pending applications·0 citations·filing 2021–2024
40Inventor score
Files withINTEL CORP8
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0162US2026090434A1Ic packages with substrates having glass cores with large footprints, thin redistribution layers, and electrical componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 0260US12568817B2Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for HSIOINTEL CORP·Filed 2022·Granted Mar 3, 2026·0 cites·11 claims
- 0360US2026086114A1Socket assemblies for semiconductor devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0459US2026005084A1Microelectronic Glass-Containing Core Layer Including Clamp StructureINTEL CORP·Filed 2024·Application pending·0 cites
- 0559US2026005173A1Embedded bridge with protection layer for via formation with bump pitch scalingINTEL CORP·Filed 2024·Application pending·0 cites
- 0658US12543578B2Electronic packaging architecture with customized variable metal thickness on same buildup layerINTEL CORP·Filed 2021·Granted Feb 3, 2026·0 cites·18 claims
- 0758US2026082970A1Integrated circuit packages including a glass-core substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 0855US12575427B2Defect-free through glass via metallization implementing a sacrificial resist thinning materialINTEL CORP·Filed 2021·Granted Mar 10, 2026·0 cites·12 claims
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Identity basis: exact name match across USPTO filings. How scoring works →