Inventor · name-matched record
NAKAKO HIDEO
2 granted patents·1 pending application·0 citations·filing 2019–2025
26Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0174US12544832B2Copper paste, wick formation method, and heat pipeRESONAC CORP·Filed 2025·Granted Feb 10, 2026·0 cites·20 claims
- 0256US2026028721A1Method for manufacturing substrate with conductive vias and method for manufacturing wiring board with conductive viasRESONAC CORP·Filed 2024·Application pending·0 cites
- 0350US12564879B2Copper paste for joining, method for manufacturing joined body, and joined bodySHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 3, 2026·0 cites·19 claims
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Identity basis: exact name match across USPTO filings. How scoring works →