Inventor · name-matched record
NAKATANI KIMIHIKO
3 granted patents·6 pending applications·0 citations·filing 2022–2025
43Inventor score
Files withKOKUSAI ELECTRIC CORP9
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
9 records- 0194US2026082833A1Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0292US2026096360A1Substrate processing apparatus, recording medium, method of processing substrate, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0378US2026015731A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0475US12525450B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jan 13, 2026·0 cites·19 claims
- 0574US12571094B2Method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Granted Mar 10, 2026·0 cites·20 claims
- 0670US12581878B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 17, 2026·0 cites·17 claims
- 0765US2026028711A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0863US2026101688A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0952US2026018413A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →