Inventor · name-matched record
PAEK JONG SIK
1 granted patent·2 pending applications·0 citations·filing 2024–2025
14Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0182US12543583B2Stacked die modules for semiconductor device assemblies and methods of manufacturing stacked die modulesMICRON TECHNOLOGY INC·Filed 2024·Granted Feb 3, 2026·0 cites·20 claims
- 0265US2026082999A1Semiconductor device and method for manufacturing the sameINTEL CORP·Filed 2024·Application pending·0 cites
- 0362US2026041004A1Three-dimensional integrated circuits, electronic systems, and methods of fabricating a three-dimensional integrated circuitMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →