Inventor · name-matched record
PAN HSIN-YU
4 granted patents·0 citations·filing 2020–2024
57Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0183US12557681B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0281US12588549B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 24, 2026·0 cites·20 claims
- 0368US12568849B2Dam for three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 3, 2026·0 cites·19 claims
- 0452US12599018B2Package structure with enhancement structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2022·Granted Apr 7, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →