Inventor · name-matched record
PAN LING
1 granted patent·4 pending applications·0 citations·filing 2022–2025
4Inventor score
Files withMICRON TECHNOLOGY INC5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0179US2026076162A1Split via structure for semiconductor device packagingMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0271US2026032823A1Microelectronic devices including embedded electronic components, and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0364US2026033351A1Stacked die semiconductor package including an array of pillar structuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0458US2026026359A1Identification marking cavity filling for semiconductor packagesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0555US12581976B2Wire bonding directly on exposed conductive vias and interconnects and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 17, 2026·0 cites·18 claims
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Identity basis: exact name match across USPTO filings. How scoring works →