Inventor · name-matched record
PAREKH KUNAL R
5 granted patents·16 pending applications·1 citations·filing 2001–2025
65Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
21 records- 0199US2026082878A1Semiconductor with through-substrate interconnectMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0294US2026026002A1Memory devicesLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 0391US2026011361A1Signal routing between memory die and logic die for performing operationsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0486US2026031178A1Repair techniques for coupled memory diesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0583US2026082886A1Monolithic conductive cylinder in a semiconductor device and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0683US2026018560A1Semiconductor device assemblies and associated methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0781US12555625B2Input/output connections of wafer-on-wafer bonded memory and logicMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 17, 2026·0 cites·21 claims
- 0879US2026068155A1Methods of forming microelectronic devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0976US12532461B2Microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 20, 2026·0 cites·20 claims
- 1070US2026033288A1Manufacturing technique for mechanical debonding of a temporary carrier wafer in a stacked semiconductor systemMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1169US2026041008A1Logic-uppermost semiconductor device assemblies with reconstituted wafers and multi-reticle dies coupled by reticle-bridging conductorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1269US2026040929A1Semiconductor device assemblies with multi-reticle dies and reticle-bridging conductorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1369US2026040977A1Panel-level formation of logic-uppermost semiconductor device assemblies with multi-reticle dies and reticle-bridging conductorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1469US2026040583A1Logic-uppermost semiconductor device assemblies with multi-reticle dies and reticle-bridging conductorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1564US12538821B2Signal routing structures including a plurality of parallel conductive lines and semiconductor device assemblies including the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 27, 2026·0 cites·20 claims
- 1661US2026011671A1Semiconductor device assemblies with discrete memory arrays and cmos devices configured for external connectionMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1760US2026011682A1Hybrid bonding of semiconductor cmos wafer and semiconductor memory array wafer using debondable carriersMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1860US2026011652A1Redundant bond pads in stacked semiconductor architecturesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1959US2026011701A1Bypass interconnections for stacked semiconductor systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2054US12525509B2Nano through substrate vias for semiconductor devices and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 13, 2026·0 cites·13 claims
- 2145US6911371B2Capacitor forming methods with barrier layers to threshold voltage shift inducing materialMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 28, 2005·1 cites·64 claims
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Identity basis: exact name match across USPTO filings. How scoring works →