Inventor · name-matched record
PARK CHANRO
12 granted patents·3 pending applications·0 citations·filing 2021–2024
79Inventor score
Files withIBM15
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
15 records- 0168US12557359B2Self-aligned backside contact with protruding source/drainIBM·Filed 2023·Granted Feb 17, 2026·0 cites·17 claims
- 0268US12557356B2Semiconductor structure with fully wrapped-around backside contactIBM·Filed 2022·Granted Feb 17, 2026·0 cites·20 claims
- 0368US12557295B2Embedded ReRAM with backside contactIBM·Filed 2022·Granted Feb 17, 2026·0 cites·19 claims
- 0467US12550376B2Work function metal patterning and middle-of-line self-aligned contacts for nanosheet technologyIBM·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0565US12588273B2Stacked electronic devices having independent gatesIBM·Filed 2023·Granted Mar 24, 2026·0 cites·20 claims
- 0664US2026090021A1Deep via to preserve substrateIBM·Filed 2024·Application pending·0 cites
- 0763US12593457B2Multi-state ferroelectric-RAM with stacked capacitorsIBM·Filed 2022·Granted Mar 31, 2026·0 cites·16 claims
- 0862US12550427B2Vertical inverter formation on stacked field effect transistor (SFET)IBM·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0962US2026052751A1Forming shared source/drain contact with a gate-cut structureIBM·Filed 2024·Application pending·0 cites
- 1062US2026059843A1Removing high-k layer from inner spacerIBM·Filed 2024·Application pending·0 cites
- 1161US12525529B2Forming line end viasIBM·Filed 2022·Granted Jan 13, 2026·0 cites·12 claims
- 1260US12538785B2Fully-aligned and dielectric damage-less top via interconnect structureIBM·Filed 2021·Granted Jan 27, 2026·0 cites·18 claims
- 1358US12550708B2Top via interconnect with an embedded antifuseIBM·Filed 2022·Granted Feb 10, 2026·0 cites·17 claims
- 1456US12575160B2Backside and frontside contacts for semiconductor deviceIBM·Filed 2022·Granted Mar 10, 2026·0 cites·20 claims
- 1554US12550338B2Three dimensional cross-point non-volatile memoryIBM·Filed 2022·Granted Feb 10, 2026·0 cites·10 claims
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Identity basis: exact name match across USPTO filings. How scoring works →