Inventor · name-matched record
PARK JEONGHWAN
0 granted patents·8 pending applications·0 citations·filing 2025–2025
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0163US2026033363A1Semiconductor package including anti-slip structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0260US2026075916A1Power semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0355US2026065038A1Method and electronic device for generating language modelSIONIC AI INC·Filed 2025·Application pending·0 cites
- 0454US2026076224A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0549US2026075873A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0649US2026075920A1Semiconductor device with gate contact region formed in partial region of gate runnerSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0747US2026076186A1Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0845US2026040610A1Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →