Inventor · name-matched record
PARK JONGCHAN
0 granted patents·3 pending applications·0 citations·filing 2024–2025
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0177US2026084240A1Laser assisted bonding device and method for large area bondingSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0265US2026076041A1Display ApparatusLG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0361US2026018476A1Semiconductor Device and Method of Forming Heat Spreader with Surface Plasma Treatment for FCBGA-H PackageSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →