Inventor · name-matched record
PATIL ANIKET
3 granted patents·10 pending applications·1 citations·filing 2022–2025
46Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
13 records- 0185US12543599B2Package comprising a first substrate, a second substrate and an electrical device coupled to a bottom surface of the second substrateQUALCOMM INC·Filed 2022·Granted Feb 3, 2026·1 cites·22 claims
- 0268US12564107B2Package comprising optical integrated deviceQUALCOMM INC·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
- 0365US2026080354A1System and method for address verificationDOORDASH INC·Filed 2025·Application pending·0 cites
- 0464US2026033364A1Package interconnect structureQUALCOMM INC·Filed 2025·Application pending·0 cites
- 0563US2026076271A1Electronic package having stepped stacked substrate structureQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0663US2026096494A1Hybrid silicon cap lsc to increase bga densityQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0762US2026096496A1Integrated device with multiple arrays of off-package interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0860US2026076270A1Device including conductive posts thermally coupling a die and an interposer structureQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0959US12593709B2Substrate(s) for an integrated circuit (IC) package employing a core layer and an adjacent insulation layer(s) with an embedded metal structure(s) positioned from the core layerQUALCOMM INC·Filed 2023·Granted Mar 31, 2026·0 cites·18 claims
- 1058US2026018548A1Conductive structure with multiple support pillarsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1156US2026033358A1Package comprising substrate with via interconnects comprising non-circular planar cross sectionQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1256US2026033352A1Package comprising an integrated device with back side metallization interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1355US2026033319A1Integrated device comprising non-circular pillar interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →