Inventor · name-matched record
PENG YU-YUN
5 granted patents·6 pending applications·0 citations·filing 2022–2025
60Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7TAIWAN SEMICONDUCTOR MFG COMPANY LTD3TAIWAN SEMICONDUCTOR MFG COMPANY LID1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
11 records- 0182US2026101681A1Wafer bonding method and semiconductor structure obtained by the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0281US2026101684A1Wafer bonding method and semiconductor structure manufactured using the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0379US2026006816A1Contact Structure For Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG COMPANY LID·Filed 2025·Application pending·0 cites
- 0478US12532716B2Low thermal budget dielectric for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 20, 2026·0 cites·20 claims
- 0566US12575141B2Metal-comprising bottom isolation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 10, 2026·0 cites·20 claims
- 0663US12599042B2Carrier structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 0763US12550720B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0860US2026096144A1Backside transistors in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0959US12575123B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
- 1059US2026075924A1Wafer bonding method and semiconductor structure obtained by the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1157US2026040984A1Wafer bonding with enhanced thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →