Inventor · name-matched record
PIETAMBARAM SRINIVAS
1 granted patent·16 pending applications·0 citations·filing 2023–2024
13Inventor score
Files withINTEL CORP17
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
17 records- 0176US12568831B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2023·Granted Mar 3, 2026·0 cites·8 claims
- 0267US2026078046A1Plasma-based glass package dicingINTEL CORP·Filed 2024·Application pending·0 cites
- 0366US2026077433A1Apparatus and Methods for Water-Assisted SingulationINTEL CORP·Filed 2024·Application pending·0 cites
- 0462US2026090434A1Ic packages with substrates having glass cores with large footprints, thin redistribution layers, and electrical componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 0560US2026086114A1Socket assemblies for semiconductor devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0659US2026005082A1Glass core edge treatments for hybrid panels in device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 0759US2026096459A1Methods of fabricating hybrid glass core package structures including 3d locking mechanismsINTEL CORP·Filed 2024·Application pending·0 cites
- 0859US2026005079A1Thin glass core panels in circuit device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 0959US2026005163A1Glass core substrates with coupled inductor structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1059US2026090433A13d printing of glass core edge protection in ic device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 1158US2026082934A1Methods for Providing Semi-transparent Substrate EdgesINTEL CORP·Filed 2024·Application pending·0 cites
- 1256US2026001805A1Hybrid Panel with an Edge Coated Glass PanelINTEL CORP·Filed 2024·Application pending·0 cites
- 1356US2026005078A1Fabricating integrated circuit packages with glass core hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 1455US2026005042A1System and method for singulation of semiconductor workpieceINTEL CORP·Filed 2024·Application pending·0 cites
- 1555US2026005186A1Semiconductor manufacturing system and methodINTEL CORP·Filed 2024·Application pending·0 cites
- 1653US2026001298A1Automated lamination link for hybrid panel conversion of glass core panelINTEL CORP·Filed 2024·Application pending·0 cites
- 1753US2026005109A1Device, method and system for supporting a glass substrate with a frame structureINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →