Inventor · name-matched record
SAKAI ATSUSHI
6 granted patents·1 pending application·0 citations·filing 2019–2023
62Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0170US2026015501A1Thermoplastic resin composition, molded product, metal foil laminated board, bonding sheet, filament, and material for three-dimensional fabricationMITSUBISHI GAS CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0269US12520463B2Electromagnetic shielding laminated sheetPANASONIC HOLDINGS CORP·Filed 2022·Granted Jan 6, 2026·0 cites·9 claims
- 0360US12577399B2Resin composition, resin molded article and method for producing sameMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Mar 17, 2026·0 cites·19 claims
- 0458US12584015B2Polyimide resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Mar 24, 2026·0 cites·14 claims
- 0550US12581722B2Semiconductor device including impurity regions and element isolation portion and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2023·Granted Mar 17, 2026·0 cites·18 claims
- 0650US12563771B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2022·Granted Feb 24, 2026·0 cites·4 claims
- 0750US12557336B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2023·Granted Feb 17, 2026·0 cites·17 claims
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Identity basis: exact name match across USPTO filings. How scoring works →