Inventor · name-matched record
SHAN BOHAN
0 granted patents·20 pending applications·0 citations·filing 2024–2024
Files withINTEL CORP20
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
20 records- 0167US2026078046A1Plasma-based glass package dicingINTEL CORP·Filed 2024·Application pending·0 cites
- 0261US2026090431A1Glass etch protection and seware reduction by coating protectionINTEL CORP·Filed 2024·Application pending·0 cites
- 0361US2026090430A1Edge coating for glass core substrate with a frameINTEL CORP·Filed 2024·Application pending·0 cites
- 0461US2026090427A1Glass core substrate with edge biasINTEL CORP·Filed 2024·Application pending·0 cites
- 0561US2026090429A1Edge coating for glass core substrate with air pressing for profile controlINTEL CORP·Filed 2024·Application pending·0 cites
- 0661US2026090424A1Singulation incorporating an etched metal channelINTEL CORP·Filed 2024·Application pending·0 cites
- 0760US2026086114A1Socket assemblies for semiconductor devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0860US2026076240A1Glass cores with tapered insulator edgesINTEL CORP·Filed 2024·Application pending·0 cites
- 0959US2026005079A1Thin glass core panels in circuit device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 1059US2026082969A1Integrated circuit packages including a glass-core substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 1159US2026040982A1Glass package with liquid metal socketingINTEL CORP·Filed 2024·Application pending·0 cites
- 1259US2026005084A1Microelectronic Glass-Containing Core Layer Including Clamp StructureINTEL CORP·Filed 2024·Application pending·0 cites
- 1359US2026090433A13d printing of glass core edge protection in ic device packagingINTEL CORP·Filed 2024·Application pending·0 cites
- 1458US2026090432A1Methods and systems for forming integrated circuit packages comprising glass layers with thin singulated portionsINTEL CORP·Filed 2024·Application pending·0 cites
- 1558US2026005114A1Frames for glass core hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 1657US2026005115A1Methods and systems for forming integrated circuit packages comprising glass layersINTEL CORP·Filed 2024·Application pending·0 cites
- 1757US2026005160A1Hybrid panel with a glass substrateINTEL CORP·Filed 2024·Application pending·0 cites
- 1857US2026001297A1Hybrid panel with a glass substrate and plated frameINTEL CORP·Filed 2024·Application pending·0 cites
- 1956US2026005078A1Fabricating integrated circuit packages with glass core hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 2056US2026082965A1Microelectronic assemblies including a glass-core with post-singulation edge featuresINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →