Inventor · name-matched record
SHIH CHAO-WEN
4 granted patents·6 pending applications·0 citations·filing 2020–2025
57Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
10 records- 0192US2026033314A1Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0291US2026076223A1Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0391US2026090409A1Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0481US12557661B2Package structure with antenna elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0580US12564108B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
- 0680US12533766B2Simplified carrier removable by reduced number of CMP processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 27, 2026·0 cites·20 claims
- 0762US2026011681A1Holding head structure and manufacturing method of semiconductor structure using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0861US2026076256A1Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0961US2026082947A1Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1047US12538814B2Semiconductor structure with a bridge embedded therein and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 27, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →