Inventor · name-matched record
SHIH YING-CHING
3 granted patents·5 pending applications·0 citations·filing 2022–2025
43Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0195US2026076277A1Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0282US2026076247A1Manufacturing method of connecting structure and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0382US2026068750A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0473US12564109B2Package component, electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
- 0567US12599031B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 7, 2026·0 cites·20 claims
- 0664US2026090374A1Semiconductor package and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0756US12538559B2Semiconductor packages and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 0856US2026101780A1Composite packages for enhancing thermal dissipation and methods for forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LIMITED·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when SHIH YING-CHING files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →