Inventor · name-matched record
SHIM JIHYE
2 granted patents·4 pending applications·0 citations·filing 2022–2025
22Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD6
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0157US2026047474A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0255US12550747B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·16 claims
- 0354US2026060134A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0448US12525525B2Semiconductor package including redistribution structure and passivation insulating film in contact with conductive padSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·18 claims
- 0544US2026060142A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0641US2026011621A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →