Inventor · name-matched record
SHUE SHAU-LIN
8 granted patents·4 pending applications·0 citations·filing 2021–2025
75Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
12 records- 0195US2026096414A1Protection liner on interconnect wire to enlarge processing window for overlying interconnect viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0290US2026076163A1Interconnect structure with hybrid barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0383US12581928B2Interconnect structure with protective etch-stopTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 17, 2026·0 cites·20 claims
- 0483US12550694B2Selective deposition for integrated circuit interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0583US12543550B2Interconnects including graphene capping and graphene barrier layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 3, 2026·0 cites·20 claims
- 0683US12525531B2Protection liner on interconnect wire to enlarge processing window for overlying interconnect viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 13, 2026·0 cites·20 claims
- 0782US12543551B2Selective formation of conductor nanowiresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 3, 2026·0 cites·20 claims
- 0882US2026033305A1Low-resistance interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0981US12564045B2Semiconductor device structure with interconnect structure having air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
- 1074US12525538B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·20 claims
- 1167US12538773B2Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 27, 2026·0 cites·20 claims
- 1263US2026052963A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →