Inventor · name-matched record
SON SANGHYUN
1 granted patent·2 pending applications·0 citations·filing 2023–2025
5Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0174US2026033356A1Method for forming an interconnect device and a method for forming a semiconductor package assemblySTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0260US2026080503A1Method and device with image processingSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0350US12535520B2Wafer type measuring apparatus and magnetic flux density measuring method using the sameSEMES CO LTD·Filed 2023·Granted Jan 27, 2026·0 cites·19 claims
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Identity basis: exact name match across USPTO filings. How scoring works →