Inventor · name-matched record
SONEDA SHINYA
4 granted patents·5 pending applications·0 citations·filing 2022–2025
52Inventor score
Files withMITSUBISHI ELECTRIC CORP9
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
9 records- 0167US12538811B2Semiconductor device comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, semiconductor device group comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, and power conversion apparatus comprising an electrode terminal and an electrode exposed in an opening provided in a mold resinMITSUBISHI ELECTRIC CORP·Filed 2023·Granted Jan 27, 2026·0 cites·19 claims
- 0263US12575167B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Granted Mar 10, 2026·0 cites·13 claims
- 0361US2026096116A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0457US2026096117A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0557US2026068276A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0656US12568638B2Semiconductor device and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2023·Granted Mar 3, 2026·0 cites·15 claims
- 0754US2026068656A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0853US12593462B2IGBT and diode with lifetime control regionsMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Mar 31, 2026·0 cites·16 claims
- 0953US2026020326A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →