Inventor · name-matched record
SU YEN-FU
0 granted patents·2 pending applications·0 citations·filing 2024–2024
Files withTAIWAN SEMICONDUCTOR MFG CO LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
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2 records- 0161US2026068745A1Package structure including a package lid with a bottom lid portion and top lid portion and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0257US2026033374A1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →