Inventor · name-matched record
SUTHRAM SAGAR
9 granted patents·8 pending applications·0 citations·filing 2022–2025
73Inventor score
Files withINTEL CORP17
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
17 records- 0184US2026026096A1Integrated circuit structures having ultra-high conductivity global routingINTEL CORP·Filed 2025·Application pending·0 cites
- 0267US12520482B2Memory arrays with backside components and angled transistorsINTEL CORP·Filed 2023·Granted Jan 6, 2026·0 cites·20 claims
- 0365US12588485B2Integrated circuit structures having airgaps for backside signal routing or power deliveryINTEL CORP·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
- 0465US12525295B2Two transistor memory cells with angled transistorsINTEL CORP·Filed 2023·Granted Jan 13, 2026·0 cites·20 claims
- 0562US12563724B2Two transistor memory cells with source-drain coupling in one transistorINTEL CORP·Filed 2022·Granted Feb 24, 2026·0 cites·20 claims
- 0662US2026006800A1Device, method and system to provide heterogeneous memory circuit stackingINTEL CORP·Filed 2024·Application pending·0 cites
- 0762US2026068697A1Through-assembly conductive vias of varying depthINTEL CORP·Filed 2024·Application pending·0 cites
- 0862US2026068621A1Conductive vias for three dimensional integrationINTEL CORP·Filed 2024·Application pending·0 cites
- 0962US2026005094A1Device, method and system to conduct heat through an active layer of an integrated circuit dieINTEL CORP·Filed 2024·Application pending·0 cites
- 1062US2026068710A1Inter-die connectivity techniques with a bridge die and through-assembly conductive viasINTEL CORP·Filed 2024·Application pending·0 cites
- 1162US2026005131A1Device, method and system to provide electrical coupling across active layers of an integrated circuit dieINTEL CORP·Filed 2024·Application pending·0 cites
- 1262US2026006801A1Vertically stacked memory arrays corresponding to respective single dopant typesINTEL CORP·Filed 2024·Application pending·0 cites
- 1359US12562215B2Providing orthogonal subarrays in a dynamic random access memoryINTEL CORP·Filed 2022·Granted Feb 24, 2026·0 cites·20 claims
- 1458US12588189B2Memory devices with vertical transistorsINTEL CORP·Filed 2022·Granted Mar 24, 2026·0 cites·10 claims
- 1558US12527026B2Field-effect transistor with hybrid switching mechanismINTEL CORP·Filed 2022·Granted Jan 13, 2026·0 cites·19 claims
- 1656US12550732B2Single conductivity type devices for low temperature computationINTEL CORP·Filed 2022·Granted Feb 10, 2026·0 cites·22 claims
- 1755US12575401B2Integrated circuit devices with angled transistors and angled routing tracksINTEL CORP·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →