Inventor · name-matched record
SWAN JOHANNA M
4 granted patents·6 pending applications·0 citations·filing 2021–2025
52Inventor score
Files withINTEL CORP10
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
10 records- 0196US2026026376A1Microelectronic assemblies with communication networksINTEL CORP·Filed 2025·Application pending·0 cites
- 0263US2026005080A1Organic interposer with inorganic layers containing passive and/or active devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0361US2026090360A1Split processing of integrated circuit layers with high accuracy bondingINTEL CORP·Filed 2024·Application pending·0 cites
- 0461US2026090452A1Integrated circuit packages including a high thermal conductivity material coupled to a substrate with microchannels in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0561US2026090450A1Integrated circuit packages including a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0660US2026090454A1Integrated circuit packages including 3 dimensional die stacks with a die having a sidewall modificationINTEL CORP·Filed 2024·Application pending·0 cites
- 0759US12538841B2Quasi-monolithic die architecturesINTEL CORP·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 0858US12581938B2Package architecture for quasi-monolithic chip with backside powerINTEL CORP·Filed 2022·Granted Mar 17, 2026·0 cites·15 claims
- 0958US12581968B2Package architecture of large dies using quasi-monolithic chip layersINTEL CORP·Filed 2022·Granted Mar 17, 2026·0 cites·20 claims
- 1055US12599033B2Quasi-monolithic integrated packaging architecture with mid-die serializer/deserializerINTEL CORP·Filed 2021·Granted Apr 7, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →