Inventor · name-matched record
TANG LAI GUAN
1 granted patent·3 pending applications·0 citations·filing 2022–2025
13Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0191US2026040930A1Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit DevicesALTERA CORP·Filed 2025·Application pending·0 cites
- 0288US2026074701A1Systems and methods for dynamic power and thermal management for programmable logic devicesALTERA CORP·Filed 2025·Application pending·0 cites
- 0370US2026030197A1Chiplet Interconnect for High Bandwidth Memory DevicesFoo Loke Yip·Filed 2025·Application pending·0 cites
- 0468US12525980B2Systems and methods for dynamic power and thermal management for programmable logic devicesINTEL CORP·Filed 2022·Granted Jan 13, 2026·0 cites·30 claims
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Identity basis: exact name match across USPTO filings. How scoring works →