Inventor · name-matched record
TANG YIQI
2 granted patents·4 pending applications·0 citations·filing 2022–2025
23Inventor score
Technology areasH10W
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0189US2026101753A1Multi-layer semiconductor package with stacked passive componentsTEXAS INSTR INCORPORATED·Filed 2025·Application pending·0 cites
- 0282US2026082961A1Semiconductor device with multiple diesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0381US2026018542A1Method of fabricating a flip-chip enhanced quad flat no-lead electronic device with conductor backed coplanar waveguide transmission line feed in multilevel package substrateTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0480US2026082931A1Electronic device and multilevel package substrate with integrated filterTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0560US12599002B2Substrate-integrated waveguideTEXAS INSTR INCORPORATED·Filed 2022·Granted Apr 7, 2026·0 cites·15 claims
- 0649US12593738B2Flip chip package for semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2022·Granted Mar 31, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →