Inventor · name-matched record
TEH CHEE HAK
2 granted patents·2 pending applications·0 citations·filing 2023–2025
34Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0191US2026040930A1Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit DevicesALTERA CORP·Filed 2025·Application pending·0 cites
- 0282US12524370B2Scalable 2.5D interface circuitry for data communication operationsALTERA CORP·Filed 2023·Granted Jan 13, 2026·0 cites·11 claims
- 0378US12572500B2Scalable network-on-chip for high-bandwidth memoryINTEL CORP·Filed 2024·Granted Mar 10, 2026·0 cites·20 claims
- 0461US2026057158A1Instantiatable and stampable partitions for network-on-chip architecture and method of processing data using thereofSKYECHIP SDN BHD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →