Inventor · name-matched record
TIEN TZU JUNG
0 granted patents·13 pending applications·0 citations·filing 2024–2024
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
13 records- 0164US2026060084A1Semiconductor package with active thermal management lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0264US2026047463A1Bonded die structures with improved bonding and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0364US2026052982A1Semiconductor device and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0463US2026005117A1Semiconductor die packages including non-active dies and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0563US2026005166A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0662US2026072171A1Time-of-flight sensor and methods for makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0761US2026068670A1Semiconductor package with active thermal managementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0859US2026020315A1Transistor with modified gate structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0958US2026047214A1Single-photon avalanche diode (spad) sensor, semiconductor structure including spad sensor, and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1058US2026047175A1Semiconductor devices having improved current/voltage characteristics and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1158US2026068281A1Semiconductor device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1258US2026047427A1Capacitor structures and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1356US2026006805A1Semiconductor structure including deep trench capacitors and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →