Inventor · name-matched record
TONG HO-MING
2 granted patents·6 pending applications·0 citations·filing 2022–2025
27Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
8 records- 0183US2026033394A1High bandwidth memory stack with side edge interconnection and 3d ic structure with the sameND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 0281US2026076267A13d integrated circuit packageND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 0373US12593688B2Manufacturing method of diamond composite waferND HI TECH LAB INC·Filed 2022·Granted Mar 31, 2026·0 cites·25 claims
- 0465US2026068186A1High-bandwidth memory stack with side edge interconnection and liquid cooling structureND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 0565US2026060072A1Semiconductor device package with sidewall-coupled thermal element and method of manufacturing the sameETRON TECH INC·Filed 2025·Application pending·0 cites
- 0664US2026090421A1Composite substrate, semiconductor device using the same and manufacturing method thereofND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 0762US2026060112A1Panel-level semiconductor package structure and method for manufacturing thereofND HI TECH LAB INC·Filed 2025·Application pending·0 cites
- 0857US12564049B2Diamond enhanced advanced ICs and advanced IC packagesND HI TECH LAB INC·Filed 2022·Granted Feb 24, 2026·0 cites·16 claims
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Identity basis: exact name match across USPTO filings. How scoring works →