Inventor · name-matched record
TSAI CHING-WEI
10 granted patents·6 pending applications·0 citations·filing 2021–2025
78Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
16 records- 0196US2026101541A1Method and device for boosting performance of finfets via strained spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0295US2026075885A1Gate-all-around structure with self substrate isolation and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0395US2026059802A1Integrated circuit structure with backside via railTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0492US2026082644A1Tuning threshold voltage in nanosheet transitor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0586US12557258B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 17, 2026·0 cites·20 claims
- 0683US12538557B2Semiconductor device and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 0778US12588492B2Power rail and signal line arrangement in integrated circuits having stacked transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 24, 2026·0 cites·20 claims
- 0878US12538518B2FinFET structure with fin top hard mask and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 27, 2026·0 cites·20 claims
- 0977US12588491B2Power rail and signal line arrangement in integrated circuits having stacked transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 24, 2026·0 cites·20 claims
- 1076US12598763B2Semiconductor device structure with metal gate stackTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 1171US12593504B2Transistors with varying width nanosheetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 31, 2026·0 cites·20 claims
- 1271US12543364B2Integrated circuit with backside metal gate cut for reduced coupling capacitanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 3, 2026·0 cites·20 claims
- 1368US12593494B2Multi-gate device and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 31, 2026·0 cites·20 claims
- 1467US12568648B2Backside source/drain contacts and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 3, 2026·0 cites·20 claims
- 1564US2026090373A1Semiconductor structure including bonding part with heat-dissipating unit and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1648US2026053073A1Super ai device by stitching techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →