Inventor · name-matched record
TSAI PO-HAO
7 granted patents·0 citations·filing 2022–2024
70Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
7 records- 0183US12543552B2Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 3, 2026·0 cites·20 claims
- 0283US12532789B2Package structure with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 20, 2026·0 cites·20 claims
- 0382US12564076B2Chip package with fan-out feature and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
- 0481US12538836B2Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 0569US12588523B2InFO-POP structures with TIVs having cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 24, 2026·0 cites·20 claims
- 0667US12532771B2Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 0757US12525556B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when TSAI PO-HAO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →