Inventor · name-matched record
TSAI YI-LIN
2 granted patents·1 pending application·0 citations·filing 2022–2024
23Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0159US12588522B2Semiconductor package structureMEDIATEK INC·Filed 2023·Granted Mar 24, 2026·0 cites·19 claims
- 0254US2026059661A1Electronic package and carrier structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0352US12593694B2Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Mar 31, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →